Understanding the Origins of Intergranular Corrosion in Copper-Containing Al-Mg-Si Alloys

Shravan K. Kairy*, Talukder Alam, Paul A. Rometsch, Chris H.J. Davies, Raj Banerjee, Nick Birbilis

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

48 Citations (Scopus)

Abstract

A definitive understanding of the mechanism of intergranular corrosion (IGC) in under-aged (UA) Cu-containing Al-Mg-Si alloys has not been clear to date. The grain boundary microstructure and chemistry in an UA Cu-containing Al-Mg-Si alloy were characterized by coupling atom probe tomography and scanning transmission electron microscopy. The rapid formation of an ultra-thin wetting Cu layer and discrete Q-phase (Al4Cu2Mg8Si7) precipitates along the grain boundaries, and a precipitate-free zone adjacent to the grain boundaries in the UA condition contribute to IGC.

Original languageEnglish
Pages (from-to)985-989
Number of pages5
JournalMetallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
Volume47
Issue number3
DOIs
Publication statusPublished - 1 Mar 2016
Externally publishedYes

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