Abstract
A definitive understanding of the mechanism of intergranular corrosion (IGC) in under-aged (UA) Cu-containing Al-Mg-Si alloys has not been clear to date. The grain boundary microstructure and chemistry in an UA Cu-containing Al-Mg-Si alloy were characterized by coupling atom probe tomography and scanning transmission electron microscopy. The rapid formation of an ultra-thin wetting Cu layer and discrete Q-phase (Al4Cu2Mg8Si7) precipitates along the grain boundaries, and a precipitate-free zone adjacent to the grain boundaries in the UA condition contribute to IGC.
Original language | English |
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Pages (from-to) | 985-989 |
Number of pages | 5 |
Journal | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science |
Volume | 47 |
Issue number | 3 |
DOIs | |
Publication status | Published - 1 Mar 2016 |
Externally published | Yes |