Abstract
The shifts between concentration-versus-depth profiles of vacancy and interstitial-type defects in ion implantation silicon were demonstrated. The effect of the angle of ion incidence was investigated. Point defects were introduced in lightly doped float zone n-type silicon by implantation with 6.8 MeV boron ions and 680 keV and 1.3 MeV protons at room temperature.
Original language | English |
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Pages (from-to) | 871-877 |
Number of pages | 7 |
Journal | Journal of Applied Physics |
Volume | 93 |
Issue number | 2 |
DOIs | |
Publication status | Published - 15 Jan 2003 |