Wafer-level flame-spray-pyrolysis deposition of gas-sensitive layers on microsensors

S. Kühne; M. Graf; A. Tricoli; F. Mayer; S. E. Pratsinis; A. Hierlemann

doi:10.1088/0960-1317/18/3/035040

Wafer-level flame-spray-pyrolysis deposition of gas-sensitive layers on microsensors

S. Kühne^*, M. Graf, A. Tricoli, F. Mayer, S. E. Pratsinis, A. Hierlemann

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

46 Citations (Scopus)

Abstract

This paper presents a CMOS-compatible wafer-level fabrication process for monolithic CMOS/MEMS sensor systems coated with sensitive layers directly deposited by means of flame spray pyrolysis (FSP). Microhotplate (νHP)-based devices, featuring an FSP directly deposited SnO₂/Pt layer, have successfully been realized on a wafer level. The thermal characterization evidenced a thermal resistance of 10.6 °C mW^-1; moreover, gas test measurements with ethanol have been performed. Microhotplate membrane deformations during device operation have been investigated and have been reduced by adjustment of the intrinsic stress of a deposited silicon nitride layer.

Original language	English
Article number	035040
Journal	Journal of Micromechanics and Microengineering
Volume	18
Issue number	3
DOIs	https://doi.org/10.1088/0960-1317/18/3/035040
Publication status	Published - 1 Mar 2008
Externally published	Yes

Access to Document

10.1088/0960-1317/18/3/035040

Cite this

@article{b65702739e314a0d88b860950e98a5bc,

title = "Wafer-level flame-spray-pyrolysis deposition of gas-sensitive layers on microsensors",

abstract = "This paper presents a CMOS-compatible wafer-level fabrication process for monolithic CMOS/MEMS sensor systems coated with sensitive layers directly deposited by means of flame spray pyrolysis (FSP). Microhotplate (νHP)-based devices, featuring an FSP directly deposited SnO2/Pt layer, have successfully been realized on a wafer level. The thermal characterization evidenced a thermal resistance of 10.6 °C mW-1; moreover, gas test measurements with ethanol have been performed. Microhotplate membrane deformations during device operation have been investigated and have been reduced by adjustment of the intrinsic stress of a deposited silicon nitride layer.",

author = "S. K{\"u}hne and M. Graf and A. Tricoli and F. Mayer and Pratsinis, {S. E.} and A. Hierlemann",

year = "2008",

month = mar,

day = "1",

doi = "10.1088/0960-1317/18/3/035040",

language = "English",

volume = "18",

journal = "Journal of Micromechanics and Microengineering",

issn = "0960-1317",

publisher = "IOP Publishing Ltd.",

number = "3",

}

TY - JOUR

T1 - Wafer-level flame-spray-pyrolysis deposition of gas-sensitive layers on microsensors

AU - Kühne, S.

AU - Graf, M.

AU - Tricoli, A.

AU - Mayer, F.

AU - Pratsinis, S. E.

AU - Hierlemann, A.

PY - 2008/3/1

Y1 - 2008/3/1

N2 - This paper presents a CMOS-compatible wafer-level fabrication process for monolithic CMOS/MEMS sensor systems coated with sensitive layers directly deposited by means of flame spray pyrolysis (FSP). Microhotplate (νHP)-based devices, featuring an FSP directly deposited SnO2/Pt layer, have successfully been realized on a wafer level. The thermal characterization evidenced a thermal resistance of 10.6 °C mW-1; moreover, gas test measurements with ethanol have been performed. Microhotplate membrane deformations during device operation have been investigated and have been reduced by adjustment of the intrinsic stress of a deposited silicon nitride layer.

AB - This paper presents a CMOS-compatible wafer-level fabrication process for monolithic CMOS/MEMS sensor systems coated with sensitive layers directly deposited by means of flame spray pyrolysis (FSP). Microhotplate (νHP)-based devices, featuring an FSP directly deposited SnO2/Pt layer, have successfully been realized on a wafer level. The thermal characterization evidenced a thermal resistance of 10.6 °C mW-1; moreover, gas test measurements with ethanol have been performed. Microhotplate membrane deformations during device operation have been investigated and have been reduced by adjustment of the intrinsic stress of a deposited silicon nitride layer.

UR - http://www.scopus.com/inward/record.url?scp=42549134936&partnerID=8YFLogxK

U2 - 10.1088/0960-1317/18/3/035040

DO - 10.1088/0960-1317/18/3/035040

M3 - Article

SN - 0960-1317

VL - 18

JO - Journal of Micromechanics and Microengineering

JF - Journal of Micromechanics and Microengineering

IS - 3

M1 - 035040

ER -

Wafer-level flame-spray-pyrolysis deposition of gas-sensitive layers on microsensors

Abstract

Access to Document

Other files and links

Fingerprint

Cite this